具体参数如下：

Rated Voltage 250 VAC, 300 VDC 额定电压250VAC，300 VDC
Rated Current 1 - 16 A 额定电流1- 16 A
Breaking Capacity 500 A - 1500 A 分断能力500 A -1500 A
Characteristic Time-Lag T 特征时间延迟T
Mounting PCB,SMT 安装PCB，SMT
Admissible Ambient Air Temp. -55 °C to 125 °C 可容许的环境空气温度。-55°C至125°C
Climatic Category 55/125/21 acc. to IEC 60068-1 气候类别55/125/21符合。IEC 60068-1
Material: Housing Ceramic 材质：外壳陶瓷
Material: Terminals Gold-Plated Copper Alloy 材质：端子镀金铜合金
Unit Weight 1 g 单位重量1克
Storage Conditions 0 °C to 60 °C, max. 70% r.h. 储存温度0°C至60°C，最大值，70％相对 湿度

Soldering Methods Reflow
Solderability 245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Soldering Heat 260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Vibration acc. to IEC 60068-2-6, test Fc
Moisture Resistance Test MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
Terminal Strength MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
Thermal Shock MIL-STD-202, Method 107D 热冲击MIL-STD-202，方法107D
(200 air-to-air cycles from -55 to （200从-55℃到的空气到空气循环
+125°C) +125°C）
Case Resistance acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
Resistance to Solvents MIL-STD-202, Method 215A